Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
32-0501-20

32-0501-20

CONN SOCKET SIP 32POS TIN

Aries Electronics

3,318 18.41
- +

RFQ

32-0501-20

Datasheet

Bulk 501 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-0501-30

32-0501-30

CONN SOCKET SIP 32POS TIN

Aries Electronics

2,341 18.41
- +

RFQ

32-0501-30

Datasheet

Bulk 501 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
416-93-264-41-006000

416-93-264-41-006000

SOCKET DUAL INLINE ELEVATD 64POS

Mill-Max Manufacturing Corp.

4,751 18.41
- +

RFQ

416-93-264-41-006000

Datasheet

Tube 416 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - -
614-43-650-31-002000

614-43-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,732 18.42
- +

RFQ

614-43-650-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-650-31-002000

614-93-650-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,406 18.42
- +

RFQ

614-93-650-31-002000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-310-61-001000

110-41-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,837 18.42
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-310-61-001000

110-91-310-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,965 18.42
- +

RFQ

Tube * Active - - - - - - - - - - - - - -
40-0518-10E

40-0518-10E

CONN SOCKET SIP 40POS GOLD

Aries Electronics

1,317 18.43
- +

RFQ

40-0518-10E

Datasheet

Bulk 518 Active SIP 40 (1 x 40) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-0508-21

22-0508-21

CONN SOCKET SIP 22POS GOLD

Aries Electronics

2,688 18.43
- +

RFQ

22-0508-21

Datasheet

Bulk 508 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
22-0508-31

22-0508-31

CONN SOCKET SIP 22POS GOLD

Aries Electronics

4,491 18.43
- +

RFQ

22-0508-31

Datasheet

Bulk 508 Active SIP 22 (1 x 22) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
22-1508-21

22-1508-21

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

1,392 18.43
- +

RFQ

22-1508-21

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
22-1508-31

22-1508-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

4,487 18.43
- +

RFQ

22-1508-31

Datasheet

Bulk 508 Active DIP, 0.2 (5.08mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
22-6621-30

22-6621-30

CONN IC DIP SOCKET 22POS TIN

Aries Electronics

1,257 18.43
- +

RFQ

22-6621-30

Datasheet

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-652-41-001000

116-47-652-41-001000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.

3,828 18.44
- +

RFQ

116-47-652-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
121-11-648-41-001000

121-11-648-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,370 18.45
- +

RFQ

121-11-648-41-001000

Datasheet

Tube 121 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-952-41-770000

104-11-952-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,364 18.45
- +

RFQ

104-11-952-41-770000

Datasheet

Tube 104 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-952-31-018000

614-93-952-31-018000

SOCKET CARRIER LOWPRO .900 52POS

Mill-Max Manufacturing Corp.

4,710 18.46
- +

RFQ

614-93-952-31-018000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-952-31-018000

614-43-952-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,461 18.46
- +

RFQ

614-43-952-31-018000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
315-13-164-41-003000

315-13-164-41-003000

SOCKET LOW PROFILE SIP 64POS

Mill-Max Manufacturing Corp.

3,176 18.49
- +

RFQ

Tube 315 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-652-11-480000

605-93-652-11-480000

SOCKET CARRIER LOWPRO .600 52POS

Mill-Max Manufacturing Corp.

1,497 18.50
- +

RFQ

605-93-652-11-480000

Datasheet

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Домой

Домой

Продукты

Продукты

Телефон

Телефон

О нас

О нас