Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
546-83-169-17-101136

546-83-169-17-101136

CONN SOCKET PGA 169POS GOLD

Preci-Dip

4,661 17.23
- +

RFQ

546-83-169-17-101136

Datasheet

Bulk 546 Active PGA 169 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
APA-648-G-J

APA-648-G-J

ADAPTER PLUG

Samtec Inc.

2,702 18.19
- +

RFQ

Tube APA Active - 48 (2 x 24) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
124-41-640-41-002000

124-41-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,528 18.19
- +

RFQ

124-41-640-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-640-41-002000

124-91-640-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,536 18.19
- +

RFQ

124-91-640-41-002000

Datasheet

Tube 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-650-41-770000

104-13-650-41-770000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.

1,095 18.20
- +

RFQ

104-13-650-41-770000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
14-3508-21

14-3508-21

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,865 18.20
- +

RFQ

14-3508-21

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-3508-31

14-3508-31

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

1,044 18.20
- +

RFQ

14-3508-31

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-810-90

18-810-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

2,625 18.20
- +

RFQ

18-810-90

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
614-93-950-31-007000

614-93-950-31-007000

SOCKET CARRIER LOWPRO .900 50POS

Mill-Max Manufacturing Corp.

4,995 18.21
- +

RFQ

614-93-950-31-007000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-648-41-003000

612-41-648-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,099 18.21
- +

RFQ

612-41-648-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-648-41-003000

612-91-648-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,513 18.21
- +

RFQ

612-91-648-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-950-31-007000

614-43-950-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

1,265 18.21
- +

RFQ

614-43-950-31-007000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-648-41-001000

614-93-648-41-001000

SOCKET CARRIER LOWPRO .600 48POS

Mill-Max Manufacturing Corp.

3,789 18.22
- +

RFQ

614-93-648-41-001000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-648-41-001000

614-43-648-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,151 18.22
- +

RFQ

614-43-648-41-001000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
38-3503-20

38-3503-20

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

2,386 18.22
- +

RFQ

38-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
38-3503-30

38-3503-30

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

4,479 18.22
- +

RFQ

38-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6503-20

40-6503-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,236 18.22
- +

RFQ

40-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6503-30

40-6503-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,746 18.22
- +

RFQ

40-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
410-13-264-41-001000

410-13-264-41-001000

SOCKET DUAL IN-LINE SLDRTL 64POS

Mill-Max Manufacturing Corp.

4,020 18.23
- +

RFQ

410-13-264-41-001000

Datasheet

Tube 410 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-952-31-002000

614-41-952-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,862 18.24
- +

RFQ

614-41-952-31-002000

Datasheet

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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