| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
917-87-210-41-053101CONN TRANSIST TO-5 10POS GOLD |
7,901 | 1.15 |
RFQ |
Datasheet |
Bulk | 917 | Active | Transistor, TO-5 | 10 (Round) | - | Gold | Flash | Beryllium Copper | Through Hole | - | Solder | - | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-610-41-009101CONN IC DIP SOCKET 10POS GOLD |
5,840 | 1.12 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-83-306-11-001101CONN IC DIP SOCKET 6POS GOLD |
5,497 | 1.25 |
RFQ |
Datasheet |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-312-41-001101CONN IC DIP SOCKET 12POS GOLD |
9,963 | 1.12 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-328-41-117101CONN IC DIP SOCKET 28POS GOLD |
8,326 | 1.13 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-87-428-41-117101CONN IC DIP SOCKET 28POS GOLD |
6,741 | 1.16 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-314-41-008101CONN IC DIP SOCKET 14POS GOLD |
8,726 | 1.17 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-83-320-41-117101CONN IC DIP SOCKET 20POS GOLD |
8,409 | 1.17 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-83-320-41-134161CONN IC DIP SOCKET 20POS GOLD |
5,866 | 1.17 |
RFQ |
Datasheet |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
115-83-420-41-001101CONN IC DIP SOCKET 20POS GOLD |
9,104 | 1.13 |
RFQ |
Bulk | 115 | Active | DIP, 0.4 (10.16mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
110-87-318-41-105191CONN IC DIP SOCKET 18POS GOLD |
7,921 | 1.17 |
RFQ |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
|
114-87-318-41-134191CONN IC DIP SOCKET 18POS GOLD |
7,294 | 1.17 |
RFQ |
Bulk | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
117-87-430-41-005101CONN IC DIP SOCKET 30POS GOLD |
7,708 | 1.13 |
RFQ |
Datasheet |
Bulk | 117 | Active | DIP, 0.4 (10.16mm) Row Spacing | 30 (2 x 15) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
117-83-620-41-005101CONN IC DIP SOCKET 20POS GOLD |
6,657 | 1.13 |
RFQ |
Datasheet |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.070 (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
A-CCS 052-Z-SMCONN SOCKET PLCC 52POS TIN |
5,161 | 1.22 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Polyamide (PA9T), Nylon 9T, Glass Filled |
|
116-87-610-41-009101CONN IC DIP SOCKET 10POS GOLD |
5,838 | 1.14 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
506-AG11D-ESLCONN IC DIP SOCKET 6POS GOLD |
8,704 | 1.23 |
RFQ |
Datasheet |
Tube | 500 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester |
|
612-87-322-41-001101CONN IC DIP SOCKET 22POS GOLD |
6,006 | 1.14 |
RFQ |
Datasheet |
Bulk | 612 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-422-41-105101CONN IC DIP SOCKET 22POS GOLD |
8,922 | 1.29 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
06-2513-10TCONN IC DIP SOCKET 6POS GOLD |
6,589 | 1.23 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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