| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
0475940002CONN SOCKET LGA 1366POS GOLD |
2,660 | 0.00 |
RFQ |
Datasheet |
Tray | 47594 | Obsolete | LGA | 1366 (32 x 41) | 0.040 (1.02mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.040 (1.01mm) | - | - | - | Liquid Crystal Polymer (LCP) |
|
0475943001CONN SOCKET LGA 1356POS GOLD |
2,198 | 0.00 |
RFQ |
Datasheet |
Tray | 47594 | Obsolete | LGA | 1356 (32 x 41) | 0.040 (1.02mm) | Gold | 15.0µin (0.38µm) | - | Surface Mount | Open Frame | - | - | - | - | - | - |
|
0475960132CONN SOCKET LGA 1156POS GOLD |
3,009 | 0.00 |
RFQ |
Datasheet |
Tray | 47596 | Obsolete | LGA | 1156 (40 x 40) | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | - | - | - | Thermoplastic |
|
|
0475960232CONN SOCKET LGA 1155POS GOLD |
2,454 | 0.00 |
RFQ |
Datasheet |
Tray | 47596 | Obsolete | LGA | 1155 (40 x 40) | 0.036 (0.91mm) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | - | - | - | Thermoplastic |
|
|
0475960233CONN SOCKET LGA 1155POS GOLD |
3,243 | 0.00 |
RFQ |
Datasheet |
Tray | 47596 | Obsolete | LGA | 1155 (40 x 40) | 0.036 (0.91mm) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | Solder | 0.036 (0.91mm) | - | - | - | Thermoplastic |
|
SA649000CONN IC DIP SOCKET 64POS GOLD |
2,853 | 0.00 |
RFQ |
Datasheet |
Tube | SA | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Thermoplastic, Polyester, Glass Filled |
|
SA649040CONN IC DIP SOCKET 64POS GOLD |
2,536 | 0.00 |
RFQ |
Datasheet |
Tube | SA | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 80.0µin (2.03µm) | Brass | Thermoplastic, Polyester, Glass Filled |
|
|
ICO-314-M-TTCONN IC DIP SOCKET 14POS TIN |
11,009 | 0.00 |
RFQ |
Datasheet |
Bulk | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
ICO-316-M-TTCONN IC DIP SOCKET 16POS TIN |
10,214 | 0.00 |
RFQ |
Datasheet |
Bulk | ICO | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polyester, Glass Filled |
|
|
232-1270-51-0602STAGGERED ZIP STRIP POCKETS 32 C |
13,041 | 0.00 |
RFQ |
- | Textool™ | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
232-1270-52-0602STAGGERED ZIP STRIP POCKETS 32 C |
14,566 | 0.00 |
RFQ |
- | Textool™ | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
232-1271-00-1102JHOEM LCC SOCKETS 32 POS SOLID LID |
2,267 | 0.00 |
RFQ |
Datasheet |
- | OEM | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
234-3034-51-0602CONN ZIG-ZAG ZIF 34POS GOLD |
13,705 | 0.00 |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
234-3034-52-0602CONN ZIG-ZAG ZIF 34POS GOLD |
14,829 | 0.00 |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 34 (2 x 17) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
235-3019-51-0602CONN ZIG-ZAG ZIF 35POS GOLD |
13,030 | 0.00 |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
235-3019-52-0602CONN ZIG-ZAG ZIF 35POS GOLD |
10,665 | 0.00 |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 35 (1 x 17, 1 x 18) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled | |
|
|
236-6225-50-0602SOCKET ZIP IN-LINE 36POS |
14,233 | 0.00 |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
239-5605-51-0602CONN SOCKET 39POS ZIP STRIP |
14,173 | 0.00 |
RFQ |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
239-5605-52-0602CONN SOCKET 39POS ZIP STRIP |
13,166 | 0.00 |
RFQ |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
251-5949-51-0602CONN ZIG-ZAG ZIF 51POS GOLD |
13,312 | 0.00 |
RFQ |
Bulk | Textool™ | Active | Zig-Zag, ZIF (ZIP) | 51 (1 x 25, 1 x 26) | 0.050 (1.27mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
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