| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1-1571552-6CONN IC DIP SOCKET 24POS TIN |
3,660 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
1571552-5CONN IC DIP SOCKET 18POS TIN |
3,489 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
1571552-8CONN IC DIP SOCKET 24POS TIN |
2,464 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
2-822064-4CONN SOCKET PQFP 100POS TIN-LEAD |
3,856 | 33.29 |
RFQ |
Datasheet |
Tube,Tube | - | Obsolete | QFP | 100 (4 x 25) | 0.025 (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.025 (0.64mm) | Tin-Lead | 200.0µin (5.08µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) |
|
510-AG90D-10CONN SOCKET SIP 10POS GOLD |
3,885 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
|
510-AG90D-20CONN SOCKET SIP 20POS GOLD |
3,860 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | SIP | 20 (1 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Thermoplastic |
|
1-1571995-0CONN SOCKET SIP 10POS TIN |
3,643 | 1.59 |
RFQ |
Datasheet |
Tube,Box | 510 | Obsolete | SIP | 10 (2 x 5) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 20.0µin (0.51µm) | Copper | Thermoplastic, Polyester |
|
|
1-822473-5CONN SOCKET PLCC 52POS TIN |
2,635 | 0.00 |
RFQ |
Datasheet |
Box | - | Obsolete | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic |
|
1-822473-7CONN SOCKET PLCC 84POS TIN |
2,246 | 0.00 |
RFQ |
Datasheet |
Box | - | Obsolete | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Thermoplastic |
|
|
2-1437531-0CONN IC DIP SOCKET 14POS GOLD |
3,326 | 2.31 |
RFQ |
Datasheet |
Tube,Box | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | - |
|
|
2-1571586-4CONN IC DIP SOCKET 16POS GOLD |
3,892 | 6.45 |
RFQ |
Datasheet |
Bulk,Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
2-382462-3CONN IC DIP SOCKET 8POS TIN |
3,481 | 0.37 |
RFQ |
Datasheet |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic |
|
840-AG11DCONN IC DIP SOCKET 40POS GOLD |
3,731 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
818-AG11D-ESCONN IC DIP SOCKET 18POS GOLD |
2,212 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
4-1571551-6CONN IC DIP SOCKET 20POS GOLD |
3,864 | 1.85 |
RFQ |
Datasheet |
Tube,Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Nickel | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
514-AG11D-ESCONN IC DIP SOCKET 14POS GOLD |
2,686 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Copper Alloy | Polyester |
|
|
9-1437535-4CONN IC DIP SOCKET 14POS GOLD |
3,839 | 0.00 |
RFQ |
Datasheet |
Tube | 500 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | - |
|
820-AG11DCONN IC DIP SOCKET 20POS GOLD |
3,137 | 0.00 |
RFQ |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester |
|
|
643653-1CONN SOCKET SIP 21POS TIN |
2,166 | 0.00 |
RFQ |
Box | Diplomate DL | Obsolete | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | |
|
643662-3CONN SOCKET SIP 30POS TIN |
3,418 | 0.00 |
RFQ |
Datasheet |
Box | Diplomate DL | Obsolete | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic, Glass Filled |
.jpg)