| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
2-640361-4CONN IC DIP SOCKET 24POS GOLD |
2,615 | 1.53 |
RFQ |
Datasheet |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Thermoplastic |
|
2-640362-4CONN IC DIP SOCKET 28POS GOLD |
3,551 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640379-4CONN IC DIP SOCKET 40POS GOLD |
3,910 | 0.00 |
RFQ |
Datasheet |
Tube | Diplomate DL | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
BU060Z-178-HTCONN IC DIP SOCKET 6POS GOLD |
2,900 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU160Z-178-HTCONN IC DIP SOCKET 16POS GOLD |
2,769 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU180Z-178-HTCONN IC DIP SOCKET 18POS GOLD |
3,143 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU200Z-178-HTCONN IC DIP SOCKET 20POS GOLD |
3,410 | 0.00 |
RFQ |
Datasheet |
Bulk | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU240Z-178-HTCONN IC DIP SOCKET 24POS GOLD |
3,619 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU400Z-178-HTCONN IC DIP SOCKET 40POS GOLD |
3,865 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU480Z-178-HTCONN IC DIP SOCKET 48POS GOLD |
2,467 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
BU640Z-178-HTCONN IC DIP SOCKET 64POS GOLD |
2,743 | 0.00 |
RFQ |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
523-93-068-10-041001PGA SOCK 68PIN 10X10 WIRE WRAP |
14,308 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-068-11-061001PGA SOCK 68PIN 11X11 WIRE WRAP |
10,471 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-101-13-061001PGA SOCK 101PIN 13X13 WIRE WRAP |
14,430 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 101 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-132-14-071001PGA SOCK 132PIN 14X14 WIRE WRAP |
10,739 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 132 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-088-13-081001PGA SOCK 88PIN 13X13 WIRE WRAP |
10,407 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-084-10-031001PGA SOCK 84PIN 10X10 WIRE WRAP |
14,816 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 84 (10 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
28-516-10CONN IC DIP SOCKET ZIF 28POS TIN |
3,767 | 0.00 |
RFQ |
Datasheet |
Bulk | 516 | Obsolete | DIP, ZIF (ZIP) | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
523-93-145-15-081001PGA SOCK 145PIN 15X15 WIRE WRAP |
12,860 | 0.00 |
RFQ |
Datasheet |
Bulk | 523 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
517-93-179-18-117006PGA SOCK 179 PIN 18X18 SOLDER TL |
14,854 | 0.00 |
RFQ |
Tube | 517 | Active | PGA | - | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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