| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DILB18P223TLFCONN DIP SOCKET SKT 18 POS |
13,055 | 0.22 |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
4726SMT SOCKET - WIDE SOIC-8 (200MIL |
6,255 | 4.38 |
RFQ |
Datasheet |
Bulk | - | Active | SOIC | 8 (2 x 4) | 0.050 (1.27mm) | - | - | - | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | - | - | - | - |
|
4727SMT SOCKET - WIDE SOIC-16 |
6,877 | 6.95 |
RFQ |
Datasheet |
Bulk | - | Active | SOIC | 16 (2 x 8) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Thermoplastic |
|
C001SRZ003-PK-SDTRANSISTOR SOCKETTO247,TO220,TO |
1,627 | 47.50 |
RFQ |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
C001SRZ003-PK-BDTRANSIST SOCKETTO247,TO220,TO3L |
2,276 | 47.50 |
RFQ |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
C082SRZ004-PK-SDTRANSISTOR SOCKET (TO247_4L) |
1,000 | 105.00 |
RFQ |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
C082SRZ004-PK-BDTRANSISTOR SOCKETTO247_4L) |
3,609 | 700.00 |
RFQ |
Bulk | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
215-1-06-003CONN IC DIP SOCKET 6POS GOLD |
2,036 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-08-003CONN IC DIP SOCKET 8POS GOLD |
2,533 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-14-003CONN IC DIP SOCKET 14POS GOLD |
2,557 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-16-003CONN IC DIP SOCKET 16POS GOLD |
3,188 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-18-003CONN IC DIP SOCKET 18POS GOLD |
2,269 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-20-003CONN IC DIP SOCKET 20POS GOLD |
3,779 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-24-006CONN IC DIP SOCKET 24POS GOLD |
2,090 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-28-006CONN IC DIP SOCKET 28POS GOLD |
3,111 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-32-006CONN IC DIP SOCKET 32POS GOLD |
3,284 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
215-1-40-006CONN IC DIP SOCKET 40POS GOLD |
3,087 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
231-20CONN SOCKET PLCC 20POS GOLD |
3,585 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
231-28CONN SOCKET PLCC 28POS GOLD |
2,664 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
231-32CONN SOCKET PLCC 32POS GOLD |
2,566 | 0.00 |
RFQ |
Datasheet |
Tube | - | Obsolete | PLCC | 32 (4 x 8) | 0.050 (1.27mm) | Gold | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
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