| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
22-4508-31CONN IC DIP SOCKET 22POS GOLD |
4,968 | 25.58 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
111-43-950-61-001000CONN IC SKT DBL |
2,355 | 25.59 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
111-93-950-61-001000CONN IC SKT DBL |
3,869 | 25.59 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
517-83-401-19-101111CONN SOCKET PGA 401POS GOLD |
3,284 | 23.99 |
RFQ |
Datasheet |
Bulk | 517 | Active | PGA | 401 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-93-064-10-051001SOCKET SOLDERTAIL 64-PGA |
3,812 | 25.61 |
RFQ |
Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-93-064-08-000001SKT PGA SOLDRTL |
4,210 | 25.61 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 64 (8 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-064-08-000002SKT PGA SOLDRTL |
4,613 | 25.61 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 64 (8 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-064-08-000003SKT PGA SOLDRTL |
1,438 | 25.61 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 64 (8 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-064-10-051002SKT PGA SOLDRTL |
4,349 | 25.61 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-064-10-051003SKT PGA SOLDRTL |
4,430 | 25.61 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 64 (10 x 10) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-43-952-61-001000CONN IC SKT DBL |
4,107 | 25.62 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-93-952-61-001000CONN IC SKT DBL |
2,245 | 25.62 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-632-61-801000CONN IC SKT DBL |
1,903 | 25.62 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-632-61-801000CONN IC SKT DBL |
1,781 | 25.62 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
30-9503-21CONN IC DIP SOCKET 30POS GOLD |
2,197 | 25.64 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-9503-31CONN IC DIP SOCKET 30POS GOLD |
4,641 | 25.64 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.9 (22.86mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
84-PGM11010-40CONN SOCKET PGA GOLD |
3,614 | 25.66 |
RFQ |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
116-43-648-61-006000CONN IC SKT DBL |
3,147 | 25.67 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-648-61-006000CONN IC SKT DBL |
3,896 | 25.67 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
32-3503-21CONN IC DIP SOCKET 32POS GOLD |
1,037 | 25.69 |
RFQ |
Datasheet |
Bulk | 503 | Active | DIP, 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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