| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
116-93-210-61-003000CONN IC SKT DBL |
1,697 | 19.75 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
126-93-636-41-003000CONN IC DIP SOCKET 36POS GOLD |
2,396 | 19.75 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
126-43-636-41-003000CONN IC SKT DBL |
1,893 | 19.75 |
RFQ |
Datasheet |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
117-93-652-41-005000CONN IC DIP SOCKET 52POS GOLD |
1,275 | 19.75 |
RFQ |
Datasheet |
Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-91-318-61-001000CONN IC SKT DBL |
3,697 | 19.76 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
104-13-950-41-780000CONN IC DIP SOCKET 50POS GOLD |
1,662 | 19.76 |
RFQ |
Datasheet |
Tube | 104 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Thermoplastic |
|
|
104-13-952-41-770000CONN IC DIP SOCKET 52POS GOLD |
4,220 | 19.78 |
RFQ |
Datasheet |
Tube | 104 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Thermoplastic |
|
|
35-0501-20CONN SOCKET SIP 35POS TIN |
3,114 | 19.79 |
RFQ |
Datasheet |
Bulk | 501 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
35-0501-30CONN SOCKET SIP 35POS TIN |
1,910 | 19.79 |
RFQ |
Datasheet |
Bulk | 501 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
116-43-310-61-007000CONN IC SKT DBL |
3,207 | 19.79 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-310-61-007000CONN IC SKT DBL |
1,306 | 19.79 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
612-41-950-41-004000SKT CARRIER SOLDRTL |
3,908 | 19.80 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-91-950-41-004000SKT CARRIER SOLDRTL |
2,625 | 19.80 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-306-61-008000CONN IC SKT DBL |
4,402 | 19.81 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-306-61-008000CONN IC SKT DBL |
1,137 | 19.81 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-308-61-105000CONN IC SKT DBL |
3,476 | 19.81 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-308-61-105000CONN IC SKT DBL |
4,972 | 19.81 |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-650-41-001000CONN IC DIP SOCKET 50POS GOLD |
1,433 | 19.81 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-650-41-001000CONN IC SKT DBL |
3,249 | 19.81 |
RFQ |
Datasheet |
Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-93-950-41-001000SOCKET CARRIER SLDRTL .900 50POS |
2,944 | 19.82 |
RFQ |
Datasheet |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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