Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
18-0501-21

18-0501-21

CONN SOCKET SIP 18POS GOLD

Aries Electronics

1,152 15.69
- +

RFQ

18-0501-21

Datasheet

Bulk 501 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-0501-31

18-0501-31

CONN SOCKET SIP 18POS GOLD

Aries Electronics

1,236 15.69
- +

RFQ

18-0501-31

Datasheet

Bulk 501 Active SIP 18 (1 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
612-43-328-41-003000

612-43-328-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,727 15.69
- +

RFQ

612-43-328-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-428-41-003000

612-43-428-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,927 15.69
- +

RFQ

612-43-428-41-003000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-628-41-003000

612-43-628-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,455 15.69
- +

RFQ

612-43-628-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-328-41-003000

612-93-328-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

2,496 15.69
- +

RFQ

612-93-328-41-003000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-428-41-003000

612-93-428-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,113 15.69
- +

RFQ

612-93-428-41-003000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-628-41-003000

612-93-628-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,077 15.69
- +

RFQ

612-93-628-41-003000

Datasheet

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-93-640-41-117000

114-93-640-41-117000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.

1,049 15.69
- +

RFQ

114-93-640-41-117000

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-43-640-41-117000

114-43-640-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

3,014 15.69
- +

RFQ

114-43-640-41-117000

Datasheet

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-93-632-41-012000

146-93-632-41-012000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.

2,923 15.70
- +

RFQ

146-93-632-41-012000

Datasheet

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
146-43-632-41-012000

146-43-632-41-012000

CONN SKT DBL

Mill-Max Manufacturing Corp.

4,572 15.70
- +

RFQ

146-43-632-41-012000

Datasheet

Tube 146 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-320-41-002000

126-41-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,091 15.70
- +

RFQ

126-41-320-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-420-41-002000

126-41-420-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

2,741 15.70
- +

RFQ

126-41-420-41-002000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-91-320-41-002000

126-91-320-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,431 15.70
- +

RFQ

126-91-320-41-002000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-632-41-001000

116-91-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,935 15.70
- +

RFQ

116-91-632-41-001000

Datasheet

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-6503-20

32-6503-20

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,382 15.71
- +

RFQ

32-6503-20

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6503-30

32-6503-30

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

3,105 15.71
- +

RFQ

32-6503-30

Datasheet

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
217-41-764-41-005000

217-41-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,382 15.71
- +

RFQ

217-41-764-41-005000

Datasheet

Tube 217 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
217-91-764-41-005000

217-91-764-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,592 15.71
- +

RFQ

217-91-764-41-005000

Datasheet

Tube 217 Active DIP, 0.75 (19.05mm) Row Spacing 64 (2 x 32) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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