Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
20-8724-610C

20-8724-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,275 15.33
- +

RFQ

20-8724-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8950-610C

20-8950-610C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,028 15.33
- +

RFQ

20-8950-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
66-PGM11054-10

66-PGM11054-10

CONN SOCKET PGA GOLD

Aries Electronics

4,317 15.33
- +

RFQ

66-PGM11054-10

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-93-432-31-007000

614-93-432-31-007000

SOCKET CARRIER LOWPRO .400 32POS

Mill-Max Manufacturing Corp.

4,502 15.34
- +

RFQ

614-93-432-31-007000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-632-31-007000

614-93-632-31-007000

SOCKET CARRIER LOWPRO .600 32POS

Mill-Max Manufacturing Corp.

4,559 15.34
- +

RFQ

614-93-632-31-007000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-432-31-007000

614-43-432-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,290 15.34
- +

RFQ

614-43-432-31-007000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-632-31-007000

614-43-632-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,773 15.34
- +

RFQ

614-43-632-31-007000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-636-31-012000

614-41-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,995 15.34
- +

RFQ

614-41-636-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-636-31-012000

614-91-636-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,659 15.34
- +

RFQ

614-91-636-31-012000

Datasheet

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-41-642-41-105000

110-41-642-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,308 15.34
- +

RFQ

110-41-642-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-91-642-41-105000

110-91-642-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,565 15.34
- +

RFQ

110-91-642-41-105000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-640-41-001000

110-11-640-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

4,900 15.34
- +

RFQ

110-11-640-41-001000

Datasheet

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-640-41-770000

104-11-640-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,807 15.35
- +

RFQ

104-11-640-41-770000

Datasheet

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-322-41-001000

612-41-322-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

1,333 15.36
- +

RFQ

612-41-322-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-422-41-001000

612-41-422-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,246 15.36
- +

RFQ

612-41-422-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-322-41-001000

612-91-322-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

4,232 15.36
- +

RFQ

612-91-322-41-001000

Datasheet

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-422-41-001000

612-91-422-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.

3,421 15.36
- +

RFQ

612-91-422-41-001000

Datasheet

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-316-G-B

APA-316-G-B

ADAPTER PLUG

Samtec Inc.

3,412 15.36
- +

RFQ

Bulk APA Active - 16 (2 x 8) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
126-41-322-41-001000

126-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,796 15.37
- +

RFQ

126-41-322-41-001000

Datasheet

Tube 126 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-41-422-41-001000

126-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

1,744 15.37
- +

RFQ

126-41-422-41-001000

Datasheet

Tube 126 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
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