Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-41-322-31-002000

614-41-322-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

4,783 14.99
- +

RFQ

614-41-322-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-422-31-002000

614-41-422-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

2,250 14.99
- +

RFQ

614-41-422-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-322-31-002000

614-91-322-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,901 14.99
- +

RFQ

614-91-322-31-002000

Datasheet

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-422-31-002000

614-91-422-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.

3,757 14.99
- +

RFQ

614-91-422-31-002000

Datasheet

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
19-71080-10

19-71080-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2,082 15.00
- +

RFQ

19-71080-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7375-10

19-7375-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

2,141 15.00
- +

RFQ

19-7375-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7400-10

19-7400-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

3,459 15.00
- +

RFQ

19-7400-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7650-10

19-7650-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

1,873 15.00
- +

RFQ

19-7650-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
19-7750-10

19-7750-10

CONN SOCKET SIP 19POS TIN

Aries Electronics

1,987 15.00
- +

RFQ

19-7750-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 19 (1 x 19) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-81000-310C

20-81000-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,315 15.00
- +

RFQ

20-81000-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81156-310C

20-81156-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,616 15.00
- +

RFQ

20-81156-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81200-310C

20-81200-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,134 15.00
- +

RFQ

20-81200-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-81250-310C

20-81250-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,824 15.00
- +

RFQ

20-81250-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8190-310C

20-8190-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

2,719 15.00
- +

RFQ

20-8190-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8240-310C

20-8240-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,122 15.00
- +

RFQ

20-8240-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8260-310C

20-8260-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

4,455 15.00
- +

RFQ

20-8260-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8280-310C

20-8280-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,909 15.00
- +

RFQ

20-8280-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8300-310C

20-8300-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,180 15.00
- +

RFQ

20-8300-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8310-310C

20-8310-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

1,174 15.00
- +

RFQ

20-8310-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8312-310C

20-8312-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

3,331 15.00
- +

RFQ

20-8312-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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