| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
210-99-640-41-001000CONN IC DIP SOCKET 40POS TINLEAD |
1,053 | 13.54 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
210-44-640-41-001000STANDRD SOLDRTL DBL SKT |
4,835 | 13.54 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-93-322-41-117000CONN IC DIP SOCKET 22POS GOLD |
4,017 | 13.54 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-93-422-41-117000CONN IC DIP SOCKET 22POS GOLD |
4,581 | 13.54 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-43-322-41-117000CONN IC SKT DBL |
1,856 | 13.54 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
24-6820-90CCONN IC DIP SOCKET 24POS GOLD |
2,534 | 13.58 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6822-90CCONN IC DIP SOCKET 24POS GOLD |
2,103 | 13.58 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6823-90CCONN IC DIP SOCKET 24POS GOLD |
1,915 | 13.58 |
RFQ |
Datasheet |
Bulk | Vertisockets™ 800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-41-316-41-105000CONN IC SKT DBL |
2,267 | 13.58 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-11-424-41-001000CONN IC SKT DBL |
4,591 | 13.61 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-41-322-41-117000CONN IC SKT DBL |
3,152 | 13.61 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-41-422-41-117000CONN IC SKT DBL |
4,989 | 13.61 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-91-322-41-117000CONN IC SKT DBL |
2,488 | 13.61 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
614-91-314-31-007000SKT CARRIER PGA |
4,476 | 13.55 |
RFQ |
Datasheet |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
15-7350-10CONN SOCKET SIP 15POS TIN |
1,914 | 13.55 |
RFQ |
Datasheet |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-7450-10CONN SOCKET SIP 15POS TIN |
3,144 | 13.55 |
RFQ |
Datasheet |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-7500-10CONN SOCKET SIP 15POS TIN |
4,979 | 13.55 |
RFQ |
Datasheet |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-7540-10CONN SOCKET SIP 15POS TIN |
2,462 | 13.55 |
RFQ |
Datasheet |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-7635-10CONN SOCKET SIP 15POS TIN |
4,372 | 13.55 |
RFQ |
Datasheet |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
15-7695-10CONN SOCKET SIP 15POS TIN |
1,476 | 13.55 |
RFQ |
Datasheet |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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