| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
614-83-101-13-061112CONN SOCKET PGA 101POS GOLD |
4,799 | 12.37 |
RFQ |
Datasheet |
Bulk | 614 | Active | PGA | 101 (13 x 13) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-41-316-41-605000CONN IC SKT DBL |
3,185 | 13.00 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-91-316-41-605000CONN IC SKT DBL |
4,527 | 13.00 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-93-316-41-117000CONN IC DIP SOCKET 16POS GOLD |
4,082 | 13.00 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
114-43-316-41-117000CONN IC SKT DBL |
1,829 | 13.00 |
RFQ |
Datasheet |
Tube | 114 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
122-11-308-41-001000CONN IC SKT DBL |
3,901 | 13.00 |
RFQ |
Datasheet |
Tube | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
210-41-632-41-001000CONN IC SKT DBL |
1,016 | 13.00 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
210-91-632-41-001000CONN IC SKT DBL |
4,379 | 13.00 |
RFQ |
Datasheet |
Tube | 210 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
146-93-314-41-012000CONN IC DIP SOCKET 14POS GOLD |
1,849 | 13.00 |
RFQ |
Datasheet |
Tube | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
146-43-314-41-012000CONN SKT DBL |
3,108 | 13.00 |
RFQ |
Datasheet |
Tube | 146 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-47-318-41-605000STANDRD SOLDRTL |
4,991 | 13.00 |
RFQ |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
18-0501-20CONN SOCKET SIP 18POS TIN |
2,633 | 13.00 |
RFQ |
Datasheet |
Bulk | 501 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-0501-30CONN SOCKET SIP 18POS TIN |
1,191 | 13.00 |
RFQ |
Datasheet |
Bulk | 501 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-320-G-MADAPTER PLUG |
1,058 | 13.00 |
RFQ |
Tube | APA | Active | - | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
117-47-620-41-005000STANDRD SOLDRTL |
4,717 | 13.01 |
RFQ |
Datasheet |
Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 20 (2 x 10) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
410-91-220-10-001000STANDRD SOLDRTL DBL SKT |
3,413 | 13.01 |
RFQ |
Datasheet |
Tube | 410 | Active | Zig-Zag, Left Stackable | 20 (2 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
410-91-220-10-002000STANDRD SOLDRTL DBL SKT |
1,913 | 13.01 |
RFQ |
Datasheet |
Tube | 410 | Active | Zig-Zag, Right Stackable | 20 (2 x 10) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
614-87-124-13-041112CONN SOCKET PGA 124POS GOLD |
2,329 | 12.40 |
RFQ |
Datasheet |
Bulk | 614 | Active | PGA | 124 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
115-91-320-41-003000SOCKET IC OPEN LOWPRO .300 20POS |
4,905 | 13.02 |
RFQ |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Thermoplastic | |
|
|
115-41-320-41-003000CONN IC SKT DBL |
4,538 | 13.02 |
RFQ |
Datasheet |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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