Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
Фотографии Производитель. Часть # Доступность Цены Количество Таблицы данных Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-83-182-18-091101

510-83-182-18-091101

CONN SOCKET PGA 182POS GOLD

Preci-Dip

8,258 8.40
- +

RFQ

510-83-182-18-091101

Datasheet

Bulk 510 Active PGA 182 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-91-304-41-001000

116-91-304-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

9,666 8.86
- +

RFQ

116-91-304-41-001000

Datasheet

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 4 (2 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
32-0511-10

32-0511-10

CONN SOCKET SIP 32POS TIN

Aries Electronics

8,553 8.87
- +

RFQ

32-0511-10

Datasheet

Bulk 511 Active SIP 32 (1 x 32) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
36-0518-00

36-0518-00

CONN SOCKET SIP 36POS GOLD

Aries Electronics

8,770 8.87
- +

RFQ

36-0518-00

Datasheet

Bulk 518 Active SIP 36 (1 x 36) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-1518-00

36-1518-00

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

8,191 8.87
- +

RFQ

36-1518-00

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
614-87-084-10-001112

614-87-084-10-001112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

9,644 8.40
- +

RFQ

614-87-084-10-001112

Datasheet

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-084-10-031112

614-87-084-10-031112

CONN SOCKET PGA 84POS GOLD

Preci-Dip

8,647 8.40
- +

RFQ

614-87-084-10-031112

Datasheet

Bulk 614 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
16-3501-21

16-3501-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

9,305 8.89
- +

RFQ

16-3501-21

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
16-3501-31

16-3501-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

5,585 8.89
- +

RFQ

16-3501-31

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
28-0511-10

28-0511-10

CONN SOCKET SIP 28POS TIN

Aries Electronics

5,009 8.89
- +

RFQ

28-0511-10

Datasheet

Bulk 511 Active SIP 28 (1 x 28) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-C182-10H

24-C182-10H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

8,291 8.89
- +

RFQ

24-C182-10H

Datasheet

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6810-90T

08-6810-90T

CONN IC DIP SOCKET 8POS TIN

Aries Electronics

6,428 8.89
- +

RFQ

08-6810-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
12-6820-90C

12-6820-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

7,267 8.89
- +

RFQ

12-6820-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6822-90C

12-6822-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

7,053 8.89
- +

RFQ

12-6822-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-6823-90C

12-6823-90C

CONN IC DIP SOCKET 12POS GOLD

Aries Electronics

8,463 8.89
- +

RFQ

12-6823-90C

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 12 (2 x 6) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
APA-628-T-N

APA-628-T-N

ADAPTER PLUG

Samtec Inc.

6,156 8.89
- +

RFQ

Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-87-650-41-004101

116-87-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip

5,393 8.43
- +

RFQ

116-87-650-41-004101

Datasheet

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-181-17-001101

510-83-181-17-001101

CONN SOCKET PGA 181POS GOLD

Preci-Dip

8,497 8.39
- +

RFQ

510-83-181-17-001101

Datasheet

Bulk 510 Active PGA 181 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
14-6511-11

14-6511-11

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

6,307 8.91
- +

RFQ

14-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
299-87-636-10-002101

299-87-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip

6,046 8.43
- +

RFQ

299-87-636-10-002101

Datasheet

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Домой

Домой

Продукты

Продукты

Телефон

Телефон

О нас

О нас