| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
14-0508-20CONN SOCKET SIP 14POS GOLD |
9,647 | 6.83 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
14-0508-30CONN SOCKET SIP 14POS GOLD |
8,794 | 6.83 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 14 (1 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
14-1508-20CONN IC DIP SOCKET 14POS GOLD |
5,032 | 6.83 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
14-1508-30CONN IC DIP SOCKET 14POS GOLD |
8,778 | 6.83 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
714-43-222-31-018000CONN IC DIP SOCKET 22POS GOLD |
8,793 | 6.83 |
RFQ |
Datasheet |
Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
APA-628-T-AADAPTER PLUG |
7,631 | 6.83 |
RFQ |
Bulk | APA | Active | - | 28 (2 x 14) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
116-87-432-41-013101CONN IC DIP SOCKET 32POS GOLD |
6,776 | 6.44 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
XR2A-4001-NCONN IC DIP SOCKET 40POS GOLD |
5,988 | 6.85 |
RFQ |
Datasheet |
Bulk | XR2 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
10-2511-11CONN IC DIP SOCKET 10POS GOLD |
9,613 | 6.85 |
RFQ |
Datasheet |
Bulk | 511 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-6513-10HCONN IC DIP SOCKET 16POS GOLD |
5,101 | 6.85 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-6513-11HCONN IC DIP SOCKET 16POS GOLD |
6,665 | 6.85 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
39-0518-11CONN SOCKET SIP 39POS GOLD |
8,024 | 6.85 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 39 (1 x 39) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
20-3518-111CONN IC DIP SOCKET 20POS GOLD |
5,125 | 6.85 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-0511-10CONN SOCKET SIP 10POS TIN |
6,553 | 6.85 |
RFQ |
Datasheet |
Bulk | 511 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 50.0µin (1.27µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-87-221-18-091101CONN SOCKET PGA 221POS GOLD |
7,390 | 6.47 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 221 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
08-2501-21CONN IC DIP SOCKET 8POS GOLD |
7,291 | 6.95 |
RFQ |
Datasheet |
Bulk | 501 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-2501-31CONN IC DIP SOCKET 8POS GOLD |
9,287 | 6.95 |
RFQ |
Datasheet |
Bulk | 501 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-87-225-18-091101CONN SOCKET PGA 225POS GOLD |
9,564 | 6.59 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 225 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
08-0501-21CONN SOCKET SIP 8POS GOLD |
9,958 | 6.98 |
RFQ |
Datasheet |
Bulk | 501 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
115-47-304-41-001000STANDRD SOLDRTL DBL SKT |
6,100 | 6.87 |
RFQ |
Datasheet |
Tube | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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