| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-87-120-13-061101CONN SOCKET PGA 120POS GOLD |
9,291 | 3.62 |
RFQ |
Datasheet |
Bulk | 510 | Active | PGA | 120 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
20-3511-10CONN IC DIP SOCKET 20POS TIN |
9,849 | 3.84 |
RFQ |
Datasheet |
Bulk | 511 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
23-0513-10CONN SOCKET SIP 23POS GOLD |
6,371 | 3.84 |
RFQ |
Datasheet |
Bulk | 0513 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
16-1518-00CONN IC DIP SOCKET 16POS GOLD |
7,309 | 3.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-0518-10TCONN SOCKET SIP 30POS GOLD |
7,434 | 3.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
33-0518-10CONN SOCKET SIP 33POS GOLD |
5,244 | 3.84 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 33 (1 x 33) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
08-0508-20CONN SOCKET SIP 8POS GOLD |
8,916 | 3.84 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
08-0508-30CONN SOCKET SIP 8POS GOLD |
8,850 | 3.84 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 8 (1 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
08-1508-20CONN IC DIP SOCKET 8POS GOLD |
7,500 | 3.84 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
08-1508-30CONN IC DIP SOCKET 8POS GOLD |
5,954 | 3.84 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
14-C280-10TCONN IC DIP SOCKET 14POS TIN |
7,269 | 3.84 |
RFQ |
Datasheet |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
116-83-424-41-011101CONN IC DIP SOCKET 24POS GOLD |
8,485 | 3.62 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-624-41-011101CONN IC DIP SOCKET 24POS GOLD |
5,616 | 3.62 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-652-31-012101CONN IC DIP SOCKET 52POS GOLD |
7,628 | 3.63 |
RFQ |
Datasheet |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-952-31-012101CONN IC DIP SOCKET 52POS GOLD |
6,290 | 3.74 |
RFQ |
Datasheet |
Bulk | 614 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-632-41-007101CONN IC DIP SOCKET 32POS GOLD |
8,569 | 3.74 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-432-41-007101CONN IC DIP SOCKET 32POS GOLD |
8,974 | 3.63 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
117-87-652-41-105101CONN IC DIP SOCKET 52POS GOLD |
9,163 | 3.99 |
RFQ |
Datasheet |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.070 (1.78mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
14-C195-10TCONN IC DIP SOCKET 14POS TIN |
8,893 | 3.87 |
RFQ |
Datasheet |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-83-628-41-105191CONN IC DIP SOCKET 28POS GOLD |
6,975 | 3.73 |
RFQ |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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