| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
06-6513-10HCONN IC DIP SOCKET 6POS GOLD |
7,199 | 2.98 |
RFQ |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
11-0513-11CONN SOCKET SIP 11POS GOLD |
8,448 | 2.98 |
RFQ |
Datasheet |
Bulk | 0513 | Active | SIP | 11 (1 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
05-0503-20CONN SOCKET SIP 5POS GOLD |
5,644 | 2.98 |
RFQ |
Datasheet |
Bulk | 0503 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
05-0503-30CONN SOCKET SIP 5POS GOLD |
7,878 | 2.98 |
RFQ |
Datasheet |
Bulk | 0503 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
12-0518-00CONN SOCKET SIP 12POS GOLD |
7,456 | 2.98 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 12 (1 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-1518-00CONN IC DIP SOCKET 12POS GOLD |
8,646 | 2.98 |
RFQ |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
17-0518-11CONN SOCKET SIP 17POS GOLD |
5,861 | 2.98 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 17 (1 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
21-0518-10HCONN SOCKET SIP 21POS GOLD |
8,370 | 2.98 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
25-0518-10CONN SOCKET SIP 25POS GOLD |
9,269 | 2.98 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-0508-20CONN SOCKET SIP 6POS GOLD |
6,234 | 2.98 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
06-0508-30CONN SOCKET SIP 6POS GOLD |
8,363 | 2.98 |
RFQ |
Datasheet |
Bulk | 508 | Active | SIP | 6 (1 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
06-1508-20CONN IC DIP SOCKET 6POS GOLD |
8,115 | 2.98 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
06-1508-30CONN IC DIP SOCKET 6POS GOLD |
5,487 | 2.98 |
RFQ |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
]-1xx-41-013000.jpg)
|
346-93-115-41-013000CONN SOCKET SIP 15POS GOLD |
8,088 | 2.98 |
RFQ |
Datasheet |
Bulk | 346 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-115-41-013000CONN SOCKET SIP 15POS GOLD |
8,982 | 2.98 |
RFQ |
Datasheet |
Bulk | 346 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
XR2P1041CONN SOCKET SIP 10POS GOLD |
5,646 | 2.99 |
RFQ |
Datasheet |
Bulk | XR2 | Active | SIP | 10 (1 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
116-87-642-41-018101CONN IC DIP SOCKET 42POS GOLD |
6,285 | 2.81 |
RFQ |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-648-41-105101CONN IC DIP SOCKET 48POS GOLD |
9,488 | 2.82 |
RFQ |
Datasheet |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-648-41-001101CONN IC DIP SOCKET 48POS GOLD |
8,583 | 2.82 |
RFQ |
Datasheet |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
23-0518-10TCONN SOCKET SIP 23POS GOLD |
9,452 | 3.00 |
RFQ |
Datasheet |
Bulk | 518 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
.jpg)