| Фотографии | Производитель. Часть # | Доступность | Цены | Количество | Таблицы данных | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
DILB8P-223TLFCONN IC DIP SOCKET 8POS TIN |
12,480 | 0.36 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
DILB14P-223TLFCONN IC DIP SOCKET 14POS TIN |
11,611 | 0.54 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
DILB16P-223TLFCONN IC DIP SOCKET 16POS TIN |
12,395 | 0.62 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
DILB20P-223TLFCONN IC DIP SOCKET 20POS TIN |
13,223 | 0.78 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
DILB24P-223TLFCONN IC DIP SOCKET 24POS TINLEAD |
13,686 | 0.85 |
RFQ |
Datasheet |
Tube | DILB | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
DILB28P-223TLFCONN IC DIP SOCKET 28POS TIN |
13,126 | 0.96 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
69802-432LFCONN SOCKET PLCC 32POS TIN |
6,480 | 1.79 |
RFQ |
Datasheet |
Tape & Reel (TR),Cut Tape (CT) | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
DILB40P-223TLFCONN IC DIP SOCKET 40POS TIN |
5,169 | 1.36 |
RFQ |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
69802-132LFCONN SOCKET PLCC 32POS TIN |
6,655 | 1.57 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
69802-032LFCONN SOCKET PLCC 32POS TIN |
5,440 | 1.57 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
69802-444LFCONN SOCKET PLCC 44POS TINLEAD |
9,546 | 2.22 |
RFQ |
Datasheet |
Tape & Reel (TR),Cut Tape (CT) | 69802 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Tin-Lead | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS), Glass Filled |
|
54020-44030LFCONN SOCKET PLCC 44POS TIN |
7,504 | 2.57 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
|
69802-044LFCONN SOCKET PLCC 44POS TIN |
5,104 | 2.64 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
DILB24P-224TLFCONN IC DIP SOCKET 24POS TINLEAD |
14,035 | 0.85 |
RFQ |
Datasheet |
Tube | DILB | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
69802-144LFCONN SOCKET PLCC 44POS TIN |
9,003 | 2.65 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
DILB18P-223TLFCONN IC DIP SOCKET 18POS TINLEAD |
14,136 | 0.71 |
RFQ |
Datasheet |
Tube | DILB | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
DILB32P-223TLFCONN IC DIP SOCKET 32POS TINLEAD |
9,344 | 1.09 |
RFQ |
Datasheet |
Tube | DILB | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
54020-32030LFCONN SOCKET PLCC 32POS TIN |
8,399 | 1.90 |
RFQ |
Datasheet |
Tube | - | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 100.0µin (2.54µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
|
DILB42P-223TLFCONN IC DIP SOCKET 42POS TINLEAD |
11,961 | 0.70 |
RFQ |
Datasheet |
Tube | DILB | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 100.0µin (2.54µm) | Copper Alloy | Polyamide (PA), Nylon |
|
|
DILB18P223TLFCONN DIP SOCKET SKT 18 POS |
13,055 | 0.22 |
RFQ |
Bulk | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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